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Compact board 'TySOM-2A' equipped with Zynq-7000 (Z-7030).
TySOM-2A is a compact prototyping board equipped with a mid-range Zynq-7000 module (Z-7030). It utilizes a large chip package (FFG676) with 250 I/Os and 4 GTX transceivers, and features a single FMC-HPC connector that allows for the use of expansion daughter cards, ensuring flexibility in peripheral selection.
Compact board 'TySOM-2' equipped with the largest class of the Zynq-7000 family.
TySOM-2 is a compact prototyping board manufactured with the XC7Z100 chip, which has the largest capacity in the Zynq 7000 family of devices. It utilizes the largest chip package (FFG900) with 362 I/O and 16 GTX transceivers, and features two FMC-HPC connectors that allow for the use of expansion daughter cards, ensuring maximum flexibility in peripheral selection.
"HES-XCVU9P-ZU7EV" equipped with Xilinx MPSoC and Virtex UltraScale+.
HES-XCVU9P-ZU7EV is designed for high-performance computing (HPC) applications that require massive digital signal processing. This board uniquely integrates the Xilinx Zynq UltraScale+ MPSoC ZU7EV and Virtex UltraScale+ VU9P.
